- Innovative structural design, with independent intellectual property rights
- Efficiency has been increased 1.3-1.5 times compared with conventional grinding machines.
- Eenergy consumption reduced by 21.7%.
- The grinding temperature is well controlled between 38℃~45℃ with no need for a heat exchanger.
- Large batch size reduces manufacturing cost, helping realize material industrialization preparation
Applications:
Si-C Anode Materials, Nano Materials, Nano-TiO2, MLCC, Ink Jet, Buffing and Polishing Materials, LCD, etc.