Designed with the dynamic centrifugal separation principle, the nano grinding machine developed and produced by Hoosun ensures barrier-free separation between grinding medium and materials and smooth discharging. The minimum size of grinding medium reaches 0.03 mm, and grinding of materials below 100 nm is possible. It is a core equipment for silicon carbon (SiC) anode material production.
- No sieve separation, smooth discharge
- Narrow particle size distribution
- High stability of batch quality
- Realize the ultra-fine nano grinding below 100nm
- Applicable to minimum media bead size of 0.03mm, mininal achievable particle size below 30nm after grinding
Si-C Anode Materials, Nano Materials, Nano-TiO2, MLCC, Ink Jet, Buffing and Polishing Materials, LCD, etc.